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Aries Electronics has Introduced a New CorrectAChip8482 BGA Adapter...

Aries Electronics, an international manufacturer of standard, programmed and custom interconnection products, has introduced a new Correct-A-Chip's8482; Ball Grid Array (BGA) adapter that allows 0.8 mm pitch devices to be mounted to PCBs laid out for 1.0 mm pitch devices, eliminating the need for new or reworked PCBs. The bottom of the new adapter mounts on a PCB with a BGA pad footprint on 1.0 mm pitch, while the top of the adapter accepts BGA devices with

0.8 mm pitch.



The new 16 X 16 array (256) ball BGA adapter measures 0.650 inches square and is constructed of 0.040 FR-4 material with 0.020 inch diameter solder balls of tin/lead 63/37. PCB plating is ENIG (immersion gold over electroless nickel) 3-8µ's8221; gold per

IPC-4552 over 100µ's8221; minimum nickel, per ASTM-B-733. The adapter's8217;s solder mask is black liquid photo imagable (LPI), and operating temperature is 221°F (105°C) continuous. Suggested PCB pad size diameter for mounting is 0.025 +0.002 (0.635 mm).



In addition to these standard materials, Aries can furnish the new adapter using special materials, platings, sizes and configurations to meet specific customer needs.



Pricing for the new Correct-A-Chip adapter (Aries number 256-301750-18) starts at $110 each in single piece quantities. Delivery is three weeks ARO.



For additional information, contact Aries Electronics, Inc., P.O. Box 130, Frenchtown,

NJ 08825. Tel: 908/996-6841; Fax: 908/996-3891

Web: www.arieselec.com, http://www.arieselec.com/products/18100.pdf

Europe contact Tel: +44 870 240 0249



READER SERVICE INQUIRIES: Please forward all reader service inquiries to Frank Folmsbee, Aries Electronics, Inc., P.O. Box 130, Frenchtown, NJ 08825.



EDITORS NOTE: Headquartered in Frenchtown, NJ, Aries Electronics, Inc., manufactures an extremely broad range of custom and standard interconnection and packaging products for electronics. Industry leading products include Zero Insertion Force (ZIF) test sockets for DIP, PGA, PLCC and SOIC devices; the Correct-A-Chip's8482; product line of intelligent connectors; adapters and connectors; several patented concepts for BGA (ball grid array) and LGA (land grid array) sockets; and an extensive array of high frequency test and burn in sockets. The company also specializes in meeting custom requirements for its customers.



Editorial Contact: Rachel Lufkin or Beth Smith @ 215/453-8700

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