Kleer today announced the launch of the Kleer Wireless Now (WiN) program that significantly accelerates the specification, design and production of high quality wireless audio products by original equipment manufacturers (OEM) and original design manufacturers (ODM). The Kleer WiN program is ideal for manufacturers of portable audio headphones and earbuds, and manufacturers of home audio speakers, headphones, TV, theater in a box, and home theaters.
Kleer is offering our OEM and ODM customers a complete product and service package to speed up, simplify, and de-risk the development of wireless audio products, said Steve Humphreys,
President 's38; CEO at Kleer. Unlike the one-size-fits-all RF PCBA daughter-board approach which forces customers to compromise their product designs, Kleer'ss WiN program means that
customers can have a PCBA optimized for their specific product industrial design.
The Wireless Now program leverages the experience of the large number of products that have come to market using Kleer KLR3012 module technology, including Cy-Fi, the world'ss first
wireless sports speaker. WiN services range from comprehensive design support to complete PCBA design services.
Not only does Kleer provide superior wireless technology, their extensive design and customer support services are highly valued by our team, said Jeff Lotman, CEO of Global Icons. During
the entire Cy-Fi development cycle, Kleer'ss applications team support was exceptional, contributing to a quality design and short development time.
The Kleer WiN program offers three separately priced bundles: Bronze WiN, Silver WiN, and Gold WiN. Each bundle includes:
> PCBA production readiness based on customer product specification, industrial design and ODM selection
> Design services and customer design support
> PCBA engineering samples and pre-production samples (if Kleer provides design services)
> KLR3012 discounted pricing for pre-production and first production builds
> Evaluation kits
> Access to Kleer'ss standard reference designs including PCB designs for iPod's174; /iPhone's8482; adaptors, headphone jack adaptors, headphones, earbuds, and speakers
> Introduction to ODMs experienced in manufacturing Kleer-based products, or support to ramp up production in a new ODM
> Regulatory certification pre-screen and support during certification process (Telec, FCC, etc.)
> Apple certification pre-screen and support during certification process (iPod and iPhone)
Kleer is attending IFA 2009 in Berlin, Germany from September 4-9. Please contact Kleer at sales(at)kleer(dot)com to arrange a meeting or to discuss the Kleer WiN program.
About Kleer
Kleer is a fabless semiconductor company that has developed the first wireless audio technology to combine high quality audio and robust ISM band coexistence with low power consumption to
address portable, home and automotive audio markets. Unlike Bluetooth, Kleer'ss patented subsampling radio architecture was designed from the ground up to communicate lossless CD-quality
digital stereo audio over a robust 2.4GHz radio link, while achieving 10 times the battery life of a comparable Bluetooth solution. Kleer'ss Audio LP technology is ideally suited for OEMs
of portable audio players, iPod's174; and other player accessories, home audio/theater systems, earphones, headphones, and speakers. Kleer distributes its products via direct sales in
North America, Korea, Japan, and via DIP International (http://www.dipinternational.co.uk) for the UK 's38; Europe. The Company is
headquartered in Cupertino, California with product development facilities in Ottawa, Ontario. For more information, contact the company at 19925 Stevens Creek Blvd. Suite 111, Cupertino,
CA, 95014, Tel: 408-973-7255, Fax: 408-973-7256, or visit the company web site at www.kleer.com.
*Apple, the Apple logo, Mac, Mac OS, Macintosh, iPod and iTunes are trademarks of Apple. Microsoft Zune is a registered trademark of Microsoft Corporation in the United States and/ or
other countries. All other trademarks, registered trademarks, products and/or services mentioned herein are the property of their respective owners.