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Conpart AS Joins HDP User Group International

The High Density Packaging User Group International, Inc. (HDP User Group), a global non-profit cooperative research and development organization for the Electronics Manufacturing industries, announces that Conpart AS has joined the organization. Conpart AS will participate in HDP User Group'ss technical programs.

The HDP organization and its member companies are excited about the addition of Conpart AS and look forward to sharing knowledge in current and future projects that will benefit all. Conpart is at the forefront of advanced electronics packaging and assembly technology. Their knowledge and expertise will be a valuable addition to HDP User Group'ss activities in that area, said Marshall Andrews, Executive Director of HDP User Group International.

Joining the HDP organization is an important step for Conpart in the effort to build our network and to spread the word about our activities says Tom Ove Gr's248;nlund, CEO at Conpart. We see a great opportunity in joining a network of leading individuals and companies working in fields and topics with high relevance to Conpart'ss technology and competence.

About Conpart AS

Conpart AS has been established to exploit the potential of high quality micro particles within the micro electronics and micro systems industry. Based on unique polymer particle technology, long experience and world class expertise within electronics packaging and assembly, they are constantly seeking new applications for their products. Conpart'ss first business area is within the ACF-field (Anisotropic Conductive Adhesive), using metal plated particles as conductive elements. Conpart'ss strategy is to create interest for their technology within the industry, and in close cooperation with leading industrial partners develop new applications.

For more information please visit www.conpart.no.

About HDP User Group

HDP User Group (www.hdpug.org) is a global research and development organization based in Scottsdale AZ, dedicated to reducing the costs and risks for the Electronics Manufacturing industry when using advanced electronic packaging and assembly. This international industry led group organizes and conducts R's38;D programs to address the technical issues facing the industry, including design, printed circuit board manufacturing, electronics assembly, and environmental compliance. HDP User Group maintains additional offices in Austin, Texas; Stockholm, Sweden; and Tokyo, Japan.

For more information, visit HDP User Group on the Internet at www.hdpug.org

or contact Darryl Reiner at darrylr (at) hdpug (dot) org, phone number +1 480-951-1963.

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