HyperTransport Consortium Presents Introducing HyperTransport 3.0 Extreme...

The HyperTransport Consortium will present a live webcast, 's8220;Introducing HyperTransport 3.0: Extreme Interconnect Performance, Extended Applicability,'s8221; highlighting the newly announced HyperTransport 3.0 standard which nearly doubles the clock speed and bandwidth of the previous HyperTransport specification release 2.0. In addition to delivering a major leap forward in performance, HyperTransport 3.0 adds a full array of new features that will be discussed including: AC coupling mode for the support of extended signal transmission distance - typical of backplane and chassis-to-chassis implementations, hot plugging, link-splitting mode and dynamic power management.

The online broadcast will cover:

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Industry trends of interconnect market

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Overview of the HyperTransport 3.0 specification

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Review of the new HyperTransport 3.0 features

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Examples of products that could benefit from HyperTransport 3.0

Presenters for May 16th broadcast will be:

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David Rich: HyperTransport Consortium president and director of AMD'ss 64-bit Embedded Business

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Brian Holden: HyperTransport Consortium vice president and chair of the technical working group

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Mario Cavalli: HyperTransport Consortium general manager

The HyperTransport's8482; Technology Consortium is a non-profit industry organization that manages and promotes low-latency HyperTransport technology.



The live webcast will take place on Tuesday, May 16, at 11 a.m. pacific time. Afterwards, it will be available on demand from the TechOnLine and the HyperTransport Consortium archives.

To attend the webcast, participants can register at http://seminar2.techonline.com/s/hypertransport_may1606

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