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Solid Developments in Laser micromachining of Silicon

Laser Light Technologies, Inc. have developed a range of approaches in laser micromachining of silicon wafers. This includes marking with galvo based YAG (fundamental and second harmonic) systems, cutting with assist gas using tripled frequency YAG laser system with precise XY stages motion, machining features using both YAG and Excimer systems. For most applications, thin layer of photoresist is applied to surface or both surfaces prior to laser machining. Re-deposited material and photoresist are then washed off, keeping the wafer clean. In some applications, "as-cut" wafers are used for holes drilling. Consecutive etching step removes residue around drilled holes.

We perform:

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silicon wafer resizing;

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cutting through holes and slots in silicon wafers;

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micromachining arrays of tapered and V-shaped grooves in silicon;

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fast (up to 100holes per second) percussion holes drilling;

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permanent marking of alpha-numeric and data matrix codes on silicon wafers.

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